BOND TECHNOLOGY LIMITED 怡邦科技有限公司 ID 70933553

  • Summary

    BOND TECHNOLOGY LIMITED 怡邦科技有限公司 was created in Hong Kong and is a Local Company - Private pursuant to local business registration law. Having the registration number 0503753, according to the government registry, it is currently Dissolved.

  • Status

    Dissolved updated recently more like this →

  • Kind

    Local Company - Private more like this →

  • Update status

    Last checked: 2026-07-22 20:01:14 UTC

  • Comments

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BOND TECHNOLOGY LIMITED ID 83605864

  • Summary

    Formed in United Kingdom, BOND TECHNOLOGY LIMITED is a registered business and is a Private Limited Company under local business registration law. Assigned the registration number 08567460, according to the relevant government agency, it is now Active Proposal To Strike Off.

  • Status

    Active Proposal To Strike Off updated recently more like this →

  • Kind

    Private Limited Company more like this →

  • Address

    12 BERWICK STREET, LONDON, UNITED KINGDOM, W1F 0PN, United Kingdom
  • Officers

    KWAME NZUMBI FERREIRA director

  • Update status

    Last checked at 2026-07-23 11:23:58 UTC