BOND TECHNOLOGY LIMITED 怡邦科技有限公司 ID 70933553
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Summary
BOND TECHNOLOGY LIMITED 怡邦科技有限公司 was created in Hong Kong and is a Local Company - Private pursuant to local business registration law. Having the registration number 0503753, according to the government registry, it is currently Dissolved.
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Status
Dissolved updated recently more like this →
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Kind
Local Company - Private more like this →
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Update status
Last checked: 2026-07-22 20:01:14 UTC
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